(1) During the process of soldering paste "warming up", try to let it naturally "warm up" and do not force heating.

(2) Before use, evenly stir the solder paste that has been "warmed back".

When manually stirring, the metal scandium used for soldering paste should be used until it is stirred evenly. When using a machine for stirring, attention should be paid to the stirring time, which should be appropriate. Excessive stirring will lead to a decrease in the viscosity of the solder paste, an increase in temperature, and a reaction between the solder powder and flux, which will affect the quality of the solder paste. The mixing time varies depending on the mixing device.

(3) The viscosity of solder paste varies according to temperature and humidity. As the temperature increases, the viscosity decreases. As humidity increases, solder paste will absorb moisture and affect quality.

(4) When the solder paste after opening is used multiple times, it must be sufficient to determine whether there is a change in quality, as the solder paste used after opening is not within the warranty range when used again.

(5) Do not lick the solder paste during use; Avoid direct contact between solder paste and skin. If you accidentally stick it, you can wipe it with a dry paper towel, alcohol cotton cloth, and finally clean it carefully with soap.

(6) Solder paste contains flammable solvents and should be kept away from ignition sources to avoid causing fires.

(7) Air devices must be installed in factories that use solder paste, and fresh air must be frequently introduced.

(8) During reflow soldering, local exhaust devices must be installed due to the decomposition of solvents and other substances in the solder paste, which can generate exhaust gas.

(9) Different types of solder paste cannot be mixed for use.

(10) Do not mix the cleaning solution used for cleaning circuit boards, templates, etc. with solder paste.

(11) Please dispose of waste solder paste strictly in accordance with relevant regulations.

(12) In long-term printing situations, the flux in the solder paste will evaporate, which will affect the detachment performance of the solder paste during printing. Therefore, containers for storing solder paste cannot be reused. The remaining solder paste on the printed screen board should be stored in other clean containers. When using it again, it should be checked for any lumps or solidification in the remaining solder paste. If it is too dry, The solder paste thinner provided by the supplier should be added and diluted before use. In addition, the printed substrate should be welded within days.